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Hoffman is collaborating with Applied Materials to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment R&D. The new Equipment and Process Innovation and Commercialization (EPIC) Center will define how future chips are made and advance US leadership in the space.
A high-velocity, collaborative, secure innovation platform that changes the way new semiconductor foundational technologies and process equipment are developed and commercialized to accelerate industry time-to-market and lower overall research and development costs.
Learn more about the project and prequalify as a subcontractor.